Thermalright ODYSSEY Thermal Pad 3.0mm - 12.8 W/m·K - High Efficiency

The Thermalright ODYSSEY Thermal Pad 3.0mm is designed to enhance heat transfer between electronic components and heatsinks in applications such as GPUs, SSDs, and VRM modules, providing strong thermal performance and long-term stability.

Key Features:

• Ultra-high thermal conductivity (12.8 W/m·K) for efficient heat dissipation
• Non-electrically conductive for safe operation
• Non-corrosive and non-curing formulation for long-term stability
• Non-toxic material for safer handling
• Suitable for larger gaps with 3.0mm thickness
• High flexibility for easy installation and cutting
• Reliable long-term thermal performance

Technical Specifications:

• Product Name: ODYSSEY Thermal Pad
• Brand: Thermalright
• Color: Gray
• Thickness: 3.0mm
• Dimensions: 85 × 45 × 3.0mm
• Density: 3.1 ± 0.2 g/cc
• Hardness: 30 – 55 Shore C
• Thermal Conductivity: 12.8 W/m·K
• Breakdown Voltage: 9.8KV (per 1mm)
• Electrical Conductivity: Non-conductive
• Features:
  • High thermal conductivity
  • Non-electrical conductive
  • Non-corrosive
  • Non-curing
  • Non-toxic